GaP Wafer, Undoped (111) 3"x0.45 mm, 1sp Fittings Heating elements are very brittle

Heating elements are very brittle and could break if the separator is too wide or if too much pressure is applied on them

Made of SS304 stainless steel

5 +/- 1 mm)

01 Ohms/cm

Dimension:                       5 mm x 10 mm +/- 0

GaP Wafer, Undoped (111) 3"x0.45 mm, 1sp Fittings Heating elements are very brittleSpecifications: GaP single crystal wafer Doping: Undoped Orientation: (111) Size: 3" diameter x 0. 45 mm Polished: one side polished Carrier Concentration: 6. 6x10^16 cm 3 Resistivity: 0. 74 Ohm. cm Mobility: 126 cm^2 Vs EPD: <2x10^5 cm 2 Surface finish (RMS or Ra) : < 8A Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater