G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法 StdPbc-0924 SEMI E10-0701 (technical revision)

SEMI E10-0701 (technical revision)

• Ammonia (NH3)

originally published in 1992

The rinse test method evaluates performance in a flushing mode while the component is in a static state (no actively moving components within the component under test)

Structural defects formed in the bulk of a silicon wafer during its growth or induced by electronic device processing can affect the performance of the circuitry fabricated on that wafer

G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法 StdPbc-0924 SEMI E10-0701 (technical revision)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org198019969 Referenced SEMI Standards None.