M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn 1-1106 (Reapproved 0512)

1-1106 (Reapproved 0512)

mask makers and mask users are hindered in the communication with each other

7 125mm鏡面研磨単結晶シリコンウェーハ（セカンダリフラットあり）

This document describes standard behaviors for automated transfer of substrates among automated material handling systems (AMHS) and equipment at FPD fabs

The heat sink mounting method for measuring junction-to-case thermal resistance will be a conservative measure of the package’s ability to transfer heat to the ambient environment because heat sinking is provided only on one side of the package

M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn 1-1106 (Reapproved 0512)This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007. Originally published in 1992; previously published March 2003. NOTICE: This document was balloted and approved for withdrawal in 2007. Dielectrically isolated (DI) wafers are used for fabricating specialized